Publications (12) Publications in which a researcher has participated View referenced research data.

filter_list Mechanics of Materials

2024

  1. Structural and optical properties of sulfurized Cu2ZnSnS4 films grown by one step method using calcined powders for electrical properties study of Al/p-Cu2ZnSnS4 Schottky diode

    MRS Advances, Vol. 9, Núm. 9, pp. 700-705

2021

  1. Nanoemulsions for synthesis of biomedical nanocarriers

    Colloids and Surfaces B: Biointerfaces, Vol. 203

  2. Spin-crossover nanoparticles anchored on MoS2 layers for heterostructures with tunable strain driven by thermal or light-induced spin switching

    Nature Chemistry, Vol. 13, Núm. 11, pp. 1101-1109

2020

  1. Self-healing properties of bioinspired amorphous CaCO3/polyphosphate-supplemented cement

    Molecules, Vol. 25, Núm. 10

2018

  1. Thermosetting composites based on bronze particles for archaeological and artistic metal heritage cloning

    Heliyon, Vol. 4, Núm. 11

2017

  1. Molecular dynamics of carrageenan composites reinforced with Cloisite Na+ montmorillonite nanoclay

    Carbohydrate Polymers, Vol. 176, pp. 117-126

2015

  1. Electrical conductivity properties of expanded graphite-polycarbonatediol polyurethane composites

    Polymer International, Vol. 64, Núm. 2, pp. 284-292

2014

  1. Changes in the thermoelectric response of vitreous carbon due to the irradiation by γ-rays

    Radiation Effects and Defects in Solids, Vol. 169, Núm. 7, pp. 620-627

  2. From kinetic to collective behavior in thermal transport on semiconductors and semiconductor nanostructures

    Journal of Applied Physics, Vol. 115, Núm. 16

  3. Physical properties and applications of InxGa1-xN nanowires

    AIP Conference Proceedings

  4. Spontaneous core-shell elemental distribution in In-rich InxGa1-xN nanowires grown by molecular beam epitaxy

    Nanotechnology, Vol. 25, Núm. 7

  5. Thermal conductivity of group-IV semiconductors from a kinetic-collective model

    Proceedings of the Royal Society A: Mathematical, Physical and Engineering Sciences, Vol. 470, Núm. 2169